Production Capacity
1800kft2/month
Layer (Mass Production)
1~26 Layers
Impedance Control
±10%
Minimum Thickness of CCL
3.0mil (including copper)
Board Thickness
6~280mil
Copper Clad Laminate
FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree) &Thermal Prepreg &Aluminum/steel base
Surface finishing
Lead free HAL, HAL/OSP, Immersion gold, Immersion Silver, Immersion Tin, Gold Finger, Flash Gold,
PCB external dimension tolerances (Routing)
±4mil
Tolerances for PTH hole
±2mil
Tolerances for NPTH hole
+0/-1mil
Inner etching
Min. Line/Space
2.5mil(A/W)
Line Width tolerance
±8%
Board Thickness (Min.)
3.0mil (including very thin copper)
Plating Hole
Min. Hole Size
6mil(drill)
Aspect Ratio(max)
12
Position Accuracy
±1.5 mil
Microvia
Min Hole Size
3mil
Aspect Ration(max)
1.25:1
Outer Etching
Min. Line Width/ Space
2.8/2.8mil(A/W)
±0.30 mil
Solder Mask
Bridge
1.5mil
Press
Thickness Tolerance
10%
Wrap/Twist
0.75%
Inner Opening(min)
(1)4/L:6mil; (2)6/L-8/L:7mil; (3)8/L or above:8mil
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